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Xiaomi's Most High-End Phone to Date: Lei Jun Shows Off Mix Fold Real Device with Red Casing, Featuring First-Ever Xi...
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Xiaomi Group announced on September 2 that the highly anticipated autumn flagship product launch event will be held at 7 PM on September 7. The event will debut several major products, including the Xiaomi Pengpai N70 Pro, N70 Max, and N90 Max smartphones, along with two flagship new releases: the Xiaomi 18 Fold foldable phone and the Tablet 9 Pro Max. Among these, the Xiaomi 18 Fold will be the global debut of the Xuanjie O3 AI flagship processor, positioning it as Xiaomi's most premium smartphone to date.
During the pre-launch phase, Xiaomi's founder, chairman, and CEO Lei Jun personally released a video on September 2 at noon, showcasing the actual appearance of the Xiaomi 18 Fold for the first time. The video reveals that the phone features a striking red shell design, a horizontal rectangular rear camera module, and a unique wide-fold aspect ratio. Lei Jun emphasized in the video that this phone represents Xiaomi's most high-end product ever.
From the side view presented in the video, the Xiaomi 18 Fold demonstrates good control over body thickness, though the camera module exhibits a noticeable protrusion. Regarding core specifications, apart from debuting the Xuanjie O3 processor, 36Kr reports that Xiaomi has informed channel distributors that the Xiaomi 18 Fold's pricing for all versions will exceed 10,000 yuan, with an expected starting price around 12,000 yuan. If accurate, this would mark Xiaomi's first smartphone with a starting price over 10,000 yuan.
The Xiaomi 18 Fold will also lead the industry in memory technology, being the global debut of CXMT LPDDR6 memory. According to previous disclosures by CXMT Technology, its self-developed LPDDR6 chips offer comprehensive performance improvements over the previous generation LPDDR5X, with peak speeds reaching 12,800 Mbps and a maximum single-chip capacity of 16GB. This configuration is expected to significantly enhance the device's AI computing and multitasking capabilities.
Looking back at earlier technical previews, during the Xiaomi Xuanjie Chip Technology Communication Conference held on August 24, Xiaomi showcased a Xuanjie O100 prototype. This prototype also featured a similar foldable design but omitted the rear camera module to highlight chip performance and cooling, incorporating an active air-cooling system capable of up to 10 watts of cooling. This provided insight into the performance potential of the Xuanjie O3 chip.
As the launch event approaches, the appearance of the Xiaomi 18 Fold marks Xiaomi's official entry into the ultra-premium foldable phone market. Its pricing strategy above 10,000 yuan and the global debut of multiple core technologies demonstrate Xiaomi's determination in its premiumization journey. This product, integrating the Xuanjie O3 chip, CXMT LPDDR6 memory, and a new foldable form factor, awaits the official reveal of its market performance and detailed specifications at the September 7 launch event.
Industry analysts believe that Xiaomi's deep integration of foldable phones with self-developed chips and new memory technology aims to establish a high-end brand image through technological differentiation. The AI capabilities of the Xuanjie O3 processor and the high-speed data processing power of LPDDR6 may bring new possibilities to the interactive experience and productivity scenarios of foldable devices, with actual performance highly anticipated by the market.
